on front Anisotropic plasma etch |
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| Process characteristics: |
| Aspect ratio Specify preferred aspect ratio (if known) of etch process. Aspect ratio is defined as (etch depth)/(undercut). |
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| Depth Depth to etch in material.
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| Etching source gases Specify preferred source gases for the etch process (if known). |
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| Material Material to be etched.
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| Minimum feature size (masked) The dimension of the smallest masked feature to be protected during the etch.
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| Minimum feature size (open) The dimension of the smallest unmasked (open) feature to be etched.
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| Sides processed |
either |
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| Equipment |
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