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About MEMS
Sheet resistance measurement: View
Process Hierarchy
Bonding
Clean
Consulting
Deposition
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
Electrical metrology
Geometric metrology
Miscellaneous metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities
If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at
engineering@mems-exchange.org
or call us at (703) 262-5368
on front
Sheet resistance measurement
Batch size
1
Current
1e-06 .. 0.2 A
Materials
metal (category), silicon (doped)
Process duration
5 min
Sheet resistance
0.005 .. 5e+06 Ω/square
Sides processed
either
Voltage
1e-06 .. 1 V
Wafer size
Wafer size
75 mm
100 mm
Equipment
OmniMap Prometrix
Equipment characteristics:
Wafer holder
Device that holds the wafers during processing.
conductive platen
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon
Wafer thickness
List or range of wafer thicknesses the tool can accept
300 .. 600 µm