Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
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  Contact sheet resistivity measurement
Batch size 1
Current 10 mA
Measurement aspect sheet resistivity
Measurement unit Ohm/sq
Sheet resistance 0.0011 .. 450000 Ω/square
Sides processed either
Temperature 25 °C
Wafer size
Wafer size
Equipment FPP-5000
Equipment characteristics:
MOS clean no
Wafer holder
Device that holds the wafers during processing.
 plastic chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 gallium arsenide, indium phosphide, silicon
Wafer thickness
List or range of wafer thicknesses the tool can accept
 200 .. 550 µm
Comments:
  • Sheet resistance measured at center, top, bottom, left, right areas of wafers or at specified locations. Different measurement patterns will require repricing.
  • Equipment can measure 4 different values: sheet resistivity, slice resistivity, V/I, and metallized thickness. Can also be used to determine doping type for substrate (p/n).
  • Sheet resistivity range = 1.1e-3 to 4.5e+5 ohm/sq
  • Slice resistivity range = 4.19e-2 mohm-cm to 17.1 kohm-cm
  • V/I range = 0.25mohm to 99.9kohm
  • metallized thickness = 20A to 243kA