Post exposure bake (SU-8) |
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| Batch size |
1 |
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| Sides processed |
both |
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| Temperature |
25 .. 150 °C |
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| Wafer size |
|
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| Equipment |
Lab-Line programmable oven |
| Equipment characteristics: |
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, no-flat, notched |
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| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
glass (category), silicon, silicon on insulator |
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| Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 3000 µm |
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