Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
  Wafer dicing
Process characteristics:
Blade thickness
Thickness of cutting blade.
Bonded wafers require dicing with 300um blade.
25 um only for silicon wafers up to 550um thick
Blade thickness
Thickness of cutting blade. Bonded wafers require dicing with 300um blade. 25 um only for silicon wafers up to 550um thick
Cuts per wafer
Number of cuts per sample
Cuts per wafer
Number of cuts per sample, must be 1 .. 200
1 .. 200
Diced wafer material
Diced wafer material*
Die separation (X-direction)
The distance between cuts in X-direction.
Die separation (X-direction)
The distance between cuts in X-direction., must be 100 .. 100000 µm
100 .. 100000 µm
Die separation (Y-direction)
The distance between cuts in Y-direction.
Die separation (Y-direction)
The distance between cuts in Y-direction., must be 100 .. 100000 µm
100 .. 100000 µm
Resist coat substrate
Do you want resist on the exposed surface of the substrate before dicing?
Resist coat substrate
Do you want resist on the exposed surface of the substrate before dicing?
Ship wafer on dicing frame
Select whether you would like the wafer to be shipped on the dicing frame or not.
Ship wafer on dicing frame*
yes no
Select whether you would like the wafer to be shipped on the dicing frame or not.
Batch size 1
Wafer size
Wafer size
Equipment Disco DAD 321 Automatic Dicer
  • Blade thicknesses: 25 um (only for silicon wafers up to 550 um thick), 100 um and 300 um.
  • Wafer thickness changes between 500um and 2mm for 25 um and 100um blades.
Equipment characteristics:
Piece dimension
Range of wafer piece dimensions the equipment can accept
 1 .. 10 cm
Piece geometry
Geometry of wafer pieces the equipment can accept
 rectangular, irregular, circular
Piece thickness
Range of wafer piece thickness the equipment can accept
 100 .. 2000 µm
Wafer geometry
Types of wafers this equipment can accept
 1-flat, 2-flat, no-flat
Wafer holder
Device that holds the wafers during processing.
 metal chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 silicon, Pyrex (Corning 7740)
Wafer thickness
List or range of wafer thicknesses the tool can accept
 100 .. 2000 µm
Comments:
  • Bonded wafers require dicing with 300um blade.
  • For delicate samples plase ask for a custom quote.