Post-exposure bake (SU-8) |
|
| Batch size |
1 |
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| Material |
SU-8 |
|---|
| Sides processed |
both |
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| Temperature |
95 °C |
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| Thermal duration |
13 min |
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| Wafer size |
|
|---|
| Equipment |
Lindberg/Blue M mechanical oven |
| Equipment characteristics: |
| Wafer holder Device that holds the wafers during processing. |
quartz boat |
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| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon, glass (category) |
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| Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 800 µm |
|---|
