Photoresist develop (SU-8) |
|
| Batch size |
1 |
|---|
| Depth |
200 µm |
|---|
| Developer Agent that reacts with masking layer (e.g., photoresist) to etch it selectively. |
MicroChem SU-8 Developer |
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| Material |
SU-8 |
|---|
| Selectivity Primary material removal rate divided by removal rates of secondary materials (i.e., factors by which primary material is removed faster than secondary materials) |
SU-8: 1 |
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| Sides processed |
both |
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| Temperature |
25 °C |
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| Wafer size |
|
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| Equipment |
Solitec 5100 |
| Equipment characteristics: |
| Wafer holder Device that holds the wafers during processing. |
vacuum chuck |
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| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon, glass (category) |
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| Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 800 µm |
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| Comments: |
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