Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
on front
  100% HMDS prime
Batch size 25
Material HMDS
Pressure
Pressure of process chamber during processing
 12 .. 24 inHg
Process duration 45 min
Sides processed either
Temperature 125 °C
Wafer size
Wafer size
Equipment SVG Autocoater 8626
Equipment characteristics:
Wafer holder
Device that holds the wafers during processing.
 vacuum chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 silicon, glass (category), quartz (single crystal), silicon on sapphire, silicon on insulator
Wafer thickness
List or range of wafer thicknesses the tool can accept
 200 .. 550 µm