Photoresist develop (Shipley 1818) |
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| Process characteristics: |
| Depth Depth of material removed by etch process |
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| Developer Agent that reacts with masking layer (e.g., photoresist) to etch it selectively. |
Microposit 351 |
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| Material |
Shipley 1818 |
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| Selectivity Primary material removal rate divided by removal rates of secondary materials (i.e., factors by which primary material is removed faster than secondary materials) |
Shipley 1818: 1 |
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| Sides processed |
both |
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| Wafer size |
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| Equipment |
Hood #1 |
| Equipment characteristics: |
| Wafer geometry Types of wafers this equipment can accept |
no-flat, 1-flat, 2-flat, notched |
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| Wafer holder Device that holds the wafers during processing. |
teflon |
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| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
glass (category), Pyrex (Corning 7740), quartz (single crystal), silicon, silicon on insulator |
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| Wafer thickness List or range of wafer thicknesses the tool can accept |
100 .. 500 µm |
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