Pre-furnace clean (for metallized wafers with DUV photoresist) |
|
| Batch size |
12 |
|---|
| Etchant Solutions and their concentrations. |
SVC 14 |
|---|
| Process duration |
60 min |
|---|
| Sides processed |
both |
|---|
| Temperature |
23 °C |
|---|
| Wafer size |
|
|---|
| Equipment |
Sink 1 |
| Equipment characteristics: |
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, no-flat |
|---|
| Wafer holder Device that holds the wafers during processing. |
teflon cassette |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon, silicon on insulator |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
300 .. 600 µm |
|---|
| Comments: |
|
