Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
  HF dip
Process characteristics:
Etchant
Specify preferred HF solution (if known).
Etchant
Specify preferred HF solution (if known).
Process duration
Specify preferred dip time (if known).
Process duration
Specify preferred dip time (if known).
unconstrained
Sides processed both
Equipment
Comments:
  • Wet chemical solutions of hydrogen fluoride used specifically to remove native oxides on silicon.