Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
  Photoresist hardbake (102 degC)
Ambient
Ambient to which substrate is exposed during processing
 air
Batch size 24
Pressure
Pressure of process chamber during processing
 1 atm
Sides processed both
Temperature 102 °C
Thermal duration 30 min
Wafer size
Wafer size
Equipment Lindberg/Blue M mechanical oven
Equipment characteristics:
Wafer holder
Device that holds the wafers during processing.
 quartz boat
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 silicon, glass (category)
Wafer thickness
List or range of wafer thicknesses the tool can accept
 200 .. 800 µm
Comments:
  • Developed photoresist coated wafer.