|
| Material |
Shipley 1818 |
|---|
| Sides processed |
both |
|---|
| Temperature |
115 °C |
|---|
| Thermal duration |
60 s |
|---|
| Wafer size |
|
|---|
| Equipment |
Thermal ace hotplate |
| Equipment characteristics: |
| Wafer geometry Types of wafers this equipment can accept |
no-flat, 1-flat, 2-flat, notched |
|---|
| Wafer holder Device that holds the wafers during processing. |
stainless steel |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
glass (category), Pyrex (Corning 7740), quartz (single crystal), silicon, silicon on insulator |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
100 .. 500 µm |
|---|
