Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
  Wafer dicing
Process characteristics:
Blade thickness
40 um metal, 100um resin
Blade thickness
40 um metal, 100um resin
Cuts per wafer
Number of cuts per wafer
Cuts per wafer
Number of cuts per wafer , must be 1 .. 200
1 .. 200
Die length
Length of die.
Die length*
Length of die., must be 0.125 .. 4000 mil
0.125 .. 4000 mil
Die width
Width of die.
Die width*
Width of die., must be 0.125 .. 4000 mil
0.125 .. 4000 mil
Wafer size
Wafer size
Equipment Dicing Saw
Equipment characteristics:
Batch sizes 50 .. 100 mm: 1
MOS clean no
Piece dimension
Range of wafer piece dimensions the equipment can accept
 10 .. 100 mm
Piece geometry
Geometry of wafer pieces the equipment can accept
 circular, irregular, other, rectangular, triangular shard
Piece thickness
Range of wafer piece thickness the equipment can accept
 0.25 .. 511 mil
Wafer geometry
Types of wafers this equipment can accept
 1-flat, 2-flat, no-flat, notched
Wafer holder
Device that holds the wafers during processing.
 metal chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 alumina, fused silica, Pyrex (Corning 7740), silicon, silicon on insulator
Wafer thickness
List or range of wafer thicknesses the tool can accept
 0.25 .. 511 mil
Comments:
  • Send dicing information. Include dicing diagram and a detailed discription, alignment marks, street widths, thickness left, etc.
  • Metal blade cuts Si and is 110 um wide. Resin blade cuts other materials and is 230 um wide.