Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
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  AES (Auger-electron spectroscopy)
Process characteristics:
Materials
Material(s) to inspect.
Materials
Available  
Selected
Material(s) to inspect.
Thickness
Thickness of material(s) layer to inspect.
Thickness
Thickness of material(s) layer to inspect., must be 10 .. 100 nm
10 .. 100 nm
Excluded materials gold (category), copper
Sides inspected
The sides of the wafer inspected by the process
 either
Wafer size
Wafer size
Equipment PHI 660 Scanning Auger Microprobe System
Equipment characteristics:
MOS clean no
Piece dimension
Range of wafer piece dimensions the equipment can accept
 1 .. 25 mm
Piece geometry
Geometry of wafer pieces the equipment can accept
 circular, irregular, other, rectangular, triangular shard
Piece thickness
Range of wafer piece thickness the equipment can accept
 100 .. 1000 µm
Wafer geometry
Types of wafers this equipment can accept
 1-flat, 2-flat, no-flat, notched
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 BK7, Borofloat (Schott), ceramic, Corning 1737, Foturan (Schott), fused silica, gallium arsenide, gallium phosphide, glass (Hoya), glass-ceramic, indium phosphide, lithium niobate, Pyrex (Corning 7740), quartz (fused silica), sapphire, silicon, silicon carbide, silicon germanium, silicon on insulator
Wafer thickness
List or range of wafer thicknesses the tool can accept
 100 .. 1000 µm
Comments:
  • The PHI 660 system is composed of a conventional scanning electron microscope with a lanthanum hexaboride (LaB6) cathode, a secondary electron detector, and an axial cylindrical mirror analyzer to detect Auger electrons produced during electron imaging. Very small spot sizes are available, down to 200A for imaging, and several thousand angstroms for rapid Auger data acquisition using high beam currents. Inert gas sputtering is used to clean surface contamination from samples and to remove material from a small area on the surface for depth profiling. Several modes of operation are available, including survey, line, profile, and elemental mapping. Multipoint analysis makes it a powerful tool for routine failure analysis and quality control of inorganic samples.
Extra terms
Customer agrees that wafers, masks, and other materials incorporating any process(es) provided by this fabrication site are to be used solely for non-commercial research purposes.