|
| Ambient Ambient to which substrate is exposed during processing |
ammonia |
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| Duration |
45 min |
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| Materials |
AZ P4400, AZ 4620 |
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| Sides processed |
both |
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| Temperature |
90 °C |
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| Wafer size |
|
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| Equipment |
Yes 310 oven |
| Equipment characteristics: |
| Batch sizes |
100 mm: 25, 150 mm: 25, 75 mm: 25 |
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| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, no-flat, notched |
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| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
fused silica, Pyrex (Corning 7740), silicon, silicon on insulator |
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| Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 1000 µm |
|---|
| Comments: |
|
