on front 5X stepper alignment and i-line exposure |
|
| Magnification |
5 |
|---|
| Material |
Arch OiR 897-10i |
|---|
| Max field size |
10 mm |
|---|
| Min feature size |
1 µm |
|---|
| Setup time |
30 min |
|---|
| Sides processed |
either |
|---|
| Wavelength Wavelength of light used during the exposure |
365 nm |
|---|
| Wafer size |
|
|---|
| Equipment |
GCA 8500 wafer stepper (5x i-line) |
| Equipment characteristics: |
| Batch sizes |
150 mm: 1 |
|---|
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, notched, no-flat |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon on insulator, silicon |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
500 .. 700 µm |
|---|
