Reactive Evaporation - Optical film coating (Leybold APS 1104) |
|
| Process characteristics: |
| Material |
|
|---|
| Thickness |
|
|---|
| Wafer size |
|
|---|
| Equipment |
Leybold APS 1104 |
| Equipment characteristics: |
| Batch sizes |
150 mm: 16 |
|---|
| Wafer geometry Types of wafers this equipment can accept |
1-flat |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon, fused silica, silicon on insulator |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
300 .. 675 µm |
|---|
| Comments: |
|
