Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
  Reactive Evaporation - Optical film coating (Leybold APS 1104)
Process characteristics:
Material
Material*
Thickness
Thickness*
must be 900 .. 2400 Å
900 .. 2400 Å
Wafer size
Wafer size
Equipment Leybold APS 1104
Equipment characteristics:
Batch sizes 150 mm: 16
Wafer geometry
Types of wafers this equipment can accept
 1-flat
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 silicon, fused silica, silicon on insulator
Wafer thickness
List or range of wafer thicknesses the tool can accept
 300 .. 675 µm
Comments:
  • PIAD : Plasma and Ion Assisted Deposition