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| Wafer size |
|
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| Equipment |
Karl Suss BA6 |
| Equipment characteristics: |
| Batch sizes |
100 mm: 2, 150 mm: 2 |
|---|
| MOS clean |
no |
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| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, notched, no-flat |
|---|
| Wafer holder Device that holds the wafers during processing. |
stainless steel |
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| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon, Pyrex (Corning 7740) |
|---|
