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| Process characteristics: |
| Depth |
|
|---|
| Etch type |
wet isotropic |
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| Material |
silicon dioxide |
|---|
| Wafer size |
|
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| Equipment |
Acid Wet Deck |
| Equipment characteristics: |
| Batch sizes |
100 mm: 25, 150 mm: 25, 75 mm: 25 |
|---|
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, no-flat |
|---|
| Wafer holder Device that holds the wafers during processing. |
teflon boat |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon on insulator, silicon |
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| Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 800 µm |
|---|
