Microwave bonder |
|
|---|---|
| Model | |
| Type | |
| Equipment Characteristics | |
| Die area Die area the equipment can accept |
6.25 cm2 |
| Die dimension Characteristic dimension of dies (e.g., side length of square) the equipment can accept |
2.5 cm |
| Die holder Device that holds the die(s) during processing |
quartz tube |
| Die materials List of allowed materials for dies accepted by this equipment |
gallium arsenide, quartz (single crystal), silicon |
| Die thickness List or range of die thicknesses the tool can accept |
10 .. 3000 µm |