Dektak IIA |
|
|---|---|
| Model | |
| Type | |
| Equipment Characteristics | |
| Wafer diameter(s) List or range of wafer diameters the tool can accept |
25 .. 100 mm |
| Wafer holder Device that holds the wafers during processing. |
plastic chuck |
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon, glass (category), gallium arsenide, sapphire, silicon on sapphire |
| Wafer thickness List or range of wafer thicknesses the tool can accept |
300 .. 600 µm |