PHI 660 Scanning Auger Microprobe System |
|
|---|---|
| Model | 660 |
| Type | commercial |
| Equipment Characteristics | |
| MOS clean | no |
| Piece dimension Range of wafer piece dimensions the equipment can accept |
1 .. 25 mm |
| Piece geometry Geometry of wafer pieces the equipment can accept |
circular, irregular, other, rectangular, triangular shard |
| Piece thickness Range of wafer piece thickness the equipment can accept |
100 .. 1000 µm |
| Wafer diameter(s) List or range of wafer diameters the tool can accept |
25 mm |
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, no-flat, notched |
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
BK7, Borofloat (Schott), ceramic, Corning 1737, Foturan (Schott), fused silica, gallium arsenide, gallium phosphide, glass (Hoya), glass-ceramic, indium phosphide, lithium niobate, Pyrex (Corning 7740), quartz (fused silica), sapphire, silicon, silicon carbide, silicon germanium, silicon on insulator |
| Wafer thickness List or range of wafer thicknesses the tool can accept |
100 .. 1000 µm |
