Dektak surface profilometer |
|
|---|---|
| Model | |
| Type | commercial |
| Equipment Characteristics | |
| Batch sizes | 2 .. 150 mm: 1 |
| Die area Die area the equipment can accept |
5 .. 10000 cm2 |
| Die holder Device that holds the die(s) during processing |
metal chuck |
| Die materials List of allowed materials for dies accepted by this equipment |
alumina |
| Die thickness List or range of die thicknesses the tool can accept |
150 mm |
| MOS clean | no |
| Piece dimension Range of wafer piece dimensions the equipment can accept |
300 .. 2000 mm |
| Piece geometry Geometry of wafer pieces the equipment can accept |
triangular shard, other, rectangular, irregular, circular |
| Wafer diameter(s) List or range of wafer diameters the tool can accept |
100 mm |
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, notched, no-flat |
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon, quartz (fused silica), silicon on insulator |
| Wafer thickness List or range of wafer thicknesses the tool can accept |
300 .. 2000 µm |