STS ASE DRIE |
|
|---|---|
| Model | ICP ASE |
| Type | commercial |
| Equipment Characteristics | |
| Batch sizes | 100 mm: 1, 150 mm: 1 |
| MOS clean | no |
| Wafer diameter(s) List or range of wafer diameters the tool can accept |
150 mm, 100 mm |
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, notched, no-flat |
| Wafer holder Device that holds the wafers during processing. |
helium clamp |
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon |
| Wafer thickness List or range of wafer thicknesses the tool can accept |
250 .. 1000 µm |