Custom PECVD |
|
|---|---|
| Model | |
| Type | commercial |
| Equipment Characteristics | |
| Batch sizes | 100 mm: 8, 125 mm: 4, 150 mm: 4, 200 mm: 2, 300 mm: 1, 50 mm: 8 |
| MOS clean | no |
| Wafer diameter(s) List or range of wafer diameters the tool can accept |
25 .. 300 mm |
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, notched, no-flat |
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
fused silica, Borofloat (Schott), indium phosphide, silicon, gallium arsenide, silicon on insulator |
| Wafer thickness List or range of wafer thicknesses the tool can accept |
100 .. 2000 µm |